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? 2014 microchip technology inc. ds40001750a-page 1 description: microchip?s MTCH6102 is a turnkey projected capacitive touch controller that simplifies adding gestures to touch interface designs with industry-leading low-power performance. it utilizes up to 15 channels to support taps, swipes, and scrolling on xy touch pads and touch screens. MTCH6102 allows designers to quickly and easily integrate projected capacitive touch into their cost-sensitive, low-power application. MTCH6102 provides developers with a flexible touch-sensing solution to optimize common constraints of size, power and cost that are critical to applications such as wearable devices, remote controls, gaming devices and track pads. applications: ? wearable devices such as headphones, watches, fitness wristbands ? track pads and computer peripherals ? input devices with configurable button, keypad or scrolling functions ? any interface with single-finger gestures to swipe, scroll, or doubletap controls ? home automation control panels ? security control keypads ? automotive center stack controls ? gaming devices ? remote control touch pads touch sensor support: ? up to 15 channels ? sensor sizes up to 120 mm (4.7?) ? individual channel tuning for optimal sensitivity ? works with printed circuit board (pcb) sensors, film, glass and flexible printed circuit (fpc) sensors cover layer support: ? plastic: up to 3 mm ? glass: up to 5 mm touch performance: ? >200 reports per second (configurable) ? 12-bit resolution coordinate reporting touch features: ? gesture detection and reporting ? self-capacitance signal acquisition ? multiple built-in filtering options power management: ? configurable sleep/idle frame rates ? standby mode <500 na (typical) ? active mode <12 ua possible communication interface: ?i 2 c? (up to 400 kbps) ? both polling and interrupt schemes supported ? sync signal allows for host frame detection ? field upgradeable over i 2 c operating conditions: ? 1.8v to 3.6v, -40c to +85c package types: ? 28-pin ssop ? 28-pin uqfn MTCH6102 MTCH6102 low-power projected capacitive touch controller free datasheet http://
MTCH6102 ds40001750a-page 2 ? 2014 microchip technology inc. table of contents 1.0 MTCH6102 block diagram...................................................................................................... ..................................................... 3 2.0 pin diagrams................................................................................................................ ................................................................ 4 3.0 MTCH6102 pinout description................................................................................................. .................................................... 5 4.0 layout...................................................................................................................... ..................................................................... 6 5.0 communication ............................................................................................................... ............................................................. 8 6.0 sensor design considerations................................................................................................ ................................................... 10 7.0 operating modes............................................................................................................. ........................................................... 13 8.0 controller commands ......................................................................................................... ....................................................... 15 9.0 touch frame control ......................................................................................................... ........................................................ 16 10.0 touch data registers....................................................................................................... .......................................................... 17 11.0 acquisition and touch parameters ........................................................................................... ................................................. 18 12.0 compensation ram ........................................................................................................... ........................................................ 20 13.0 baseline................................................................................................................... ................................................................... 21 14.0 gesture features and parameters ............................................................................................ ................................................. 22 15.0 configuring a non-default application ...................................................................................... ................................................. 26 16.0 manufacturing testing ...................................................................................................... .......................................................... 27 17.0 memory map ................................................................................................................. ............................................................. 28 18.0 electrical characteristics ................................................................................................. ........................................................... 31 19.0 ordering information ....................................................................................................... ........................................................... 35 20.0 packaging information...................................................................................................... .......................................................... 36 the microchip web 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? 2014 microchip technology inc. ds40001750a-page 3 MTCH6102 1.0 MTCH6102 block diagram figure 1-1: mtch6 102 block diagram i 2 c dd configuration ram touch ram acquisition ram cvd acquisition engine touch decoding gesture engine core ram timing engine rx sensor channels host controller sync int host controller host controller free datasheet http://
MTCH6102 ds40001750a-page 4 ? 2014 microchip technology inc. 2.0 pin diagrams figure 2-1: 28-pin uqfn (4x4) figure 2-2: 28-pin ssop MTCH6102 rx11 rx12 nc rx13 v ss nc nc rx10 rx9 reset nc nc rx8 rx7 rx6 rx5 rx4 rx3 v dd v ss rx2 int sync rx14 scl sda rx0 rx1 28 27 26 25 24 23 22 8 9 10 11 12 13 14 1 2 3 4 5 6 7 21 20 19 18 17 16 15 MTCH6102 reset rx9 rx10 rx11 rx12 nc rx13 v ss nc nc int sync rx14 scl nc nc rx8 rx7 rx6 rx5 rx4 rx3 v dd v ss rx2 rx1 rx0 sda 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15 free datasheet http://
? 2014 microchip technology inc. ds40001750a-page 5 MTCH6102 3.0 MTCH6102 pinout description table 3-1: MTCH6102 pinout description pin name uqfn pin ssop pin pin type description reset 26 1 i master reset with internal pull-up scl 11 14 i/o i 2 c? clock sda 12 15 i/o i 2 c data input/output int 8 11 o interrupt request output sync 9 12 o synchronous frame output rx0 13 16 i/o touch sensor channel input rx1 14 17 i/o rx2 15 18 i/o rx3 18 21 i/o rx4 19 22 i/o rx5 20 23 i/o rx6 21 24 i/o rx7 22 25 i/o rx8 23 26 i/o rx9 27 2 i/o rx10 28 3 i/o rx11 1 4 i/o rx12 2 5 i/o rx13 4 7 i/o rx14 10 13 i/o v dd 17 20 power positive supply v ss 5,16 8,19 power ground reference n/c 3, 6, 7, 24, 25 6, 9, 10, 27, 28 n/c no connect free datasheet http://
MTCH6102 ds40001750a-page 6 ? 2014 microchip technology inc. 4.0 layout figure 4-1: typical application circuit MTCH6102 rx11 rx12 nc rx13 v ss nc nc rx10 rx9 reset nc nc rx8 rx7 rx6 rx5 rx4 rx3 v dd v ss rx2 int sync rx14 scl sda rx0 rx1 28 27 26 25 24 23 22 8 9 10 11 12 13 14 1 2 3 4 5 6 7 21 20 19 18 17 16 15 0.1 ? f 10 ? f v 20k 4.7k 1.8k v v host controller v free datasheet http://
? 2014 microchip technology inc. ds40001750a-page 7 MTCH6102 4.1 decoupling capacitors the use of decoupling capacitors on power-supply pins, such as v dd and v ss , is required. consider the following criteria when using decoupling capacitors: 1. value and type of capacitor: a value of 0.1 f (100 nf), 10-20v is recommended. the capacitor should be a low equivalent series resistance (low esr) capacitor and have resonance frequency in the range of 20 mhz and higher. it is further recommended that ceramic capacitors be used. 2. placement on the printed circuit board: the decoupling capacitors should be placed as close to the pins as possible. it is recommended that the capacitors be placed on the same side of the board as the device. if space is constricted, the capacitor can be placed on another layer on the pcb using a via; however, ensure that the trace length from the pin to the capacitor is within one-quarter inch (6 mm) in length. 3. handling high-frequency noise: if the board is experiencing high-frequency noise, upward of tens of mhz, add a second ceramic-type capacitor in parallel to the above-described decoupling capacitor. the value of the second capacitor can be in the range of 0.01 f to 0.001 f. place this second capacitor next to the primary decoupling capacitor. in high-speed circuit designs, consider implementing a decade pair of capacitances as close to the power and ground pins as possible (for example, 0.1 f in parallel with 0.001 f). 4. maximizing performance: on the board layout from the power supply circuit, run the power and return traces to the decoupling capacitors first, and then to the device pins. this ensures that the decoupling capacitors are first in the power chain. it is equally important to keep the trace length between the capacitor and the power pins to a minimum, thereby reducing pcb track inductance. 4.2 bulk capacitors the use of a bulk capacitor is recommended to improve power-supply stability. typical values range from 4.7 f to 47 f. this capacitor should be located as close to the device as possible. free datasheet http://
MTCH6102 ds40001750a-page 8 ? 2014 microchip technology inc. 5.0 communication 5.1 i 2 c pin specification 5.1.1 description the MTCH6102 low-power projected capacitive touch controller uses a standard register-based read/write i 2 c protocol based upon the memory map. this protocol is similar to many other devices such as temperature sensors and serial eeproms. although data can be read at any time (polling), an interrupt pin (int) is provided for flexible integration options. 5.1.2 reading/writing registers to access memory (both to read or write), the i 2 c transaction must start by addressing the chip with the write bit set, then writing out a single byte of data representing the memory address to be operated on. after that, the host can choose to do either of the following (see figure 5-1 ): 1. to write memory, continue writing [n] data bytes (see figure 5-2 ). 2. to read memory, restart the i 2 c transaction (via either a stop-start or restart), then address the chip with the read bit set. continue to read in [n] data bytes (see figure 5-3 ). during either of these transactions, multiple bytes within the same block may be read or written due to the device?s address auto-increment feature. see section 17.0 ?memory map? for block separation. figure 5-1: i 2 c? transaction diagram figure 5-2: example i 2 c? write transaction figure 5-3: example i 2 c? read transaction data in data in ... p sr i 2 caddr r data out ... p data out s i 2 caddr w regaddr write read s w r p i 2 caddr regaddr start condition write bit read bit stop condition sr restart condition i 2 c tm device address ( ]? 7) register address s 0x25 w ack 0x04 0x80 p / ? c dd ack ack address data s 0x25 w ack sr 0x10 0x25 r ack 0x01 nk p int i ? c dd ack address data free datasheet http://
? 2014 microchip technology inc. ds40001750a-page 9 MTCH6102 5.1.3 device addressing the MTCH6102 default 7-bit base address is 0x25. every transmission must be prefixed with this address, as well as a bit signifying whether the transmission is a master write (? 0 ?) or master read (? 1 ?). after appending this read/write bit to the base address, this first byte becomes either 0x4a (write) or 0x4b (read). this address can be modified (see i 2 caddr ), but this requires initially communicating with the device under the default address. if this is not feasible in the user?s application, contact microchip support for additional options. 5.2 interrupt pin MTCH6102 provides an open-collector active-low interrupt pin (int) that will be asserted any time new data is available. int is automatically released under two conditions: 1. a read is performed of any register within the device. 2. the next frame of decoding has started. 5.3 sync output pin MTCH6102 provides an active-high sync signal that correlates with the current touch frame status. the sync pin is low while the device is sleeping (between frames) and high while touch sensing/decoding is occurring. a common use of this pin includes a host that makes use of data on every frame (such as raw-acquisition data), for host-side decoding (see figure 5-4 ). figure 5-4: example int/sync logic i 2 c dd int sync b a c d e f g j hi a controller sleeping f int is released as controller goes to sleep b controller decoding g int is asserted due to (d) c touch frame h int is released due to i 2 c? read d finger is present i int is released due to i 2 c? read e int asserted due to (d) j finger is not present free datasheet http://
MTCH6102 ds40001750a-page 10 ? 2014 microchip technology inc. 6.0 sensor design considerations 6.1 general guidelines figure 6-1: diamond dimension guidelines 6.1.1 prototyping designs touch sensor designs typically require a thorough debugging phase to ensure a reliable product. if possible, it is suggested that flexible prototyping hardware be created with this in mind. a common example is providing external access to the communication lines for quick test and tuning while in-circuit. 6.1.2 sensor overlay material to prevent saturation of sensor levels, a minimum overlay of 0.5 mm plastic or glass is required for proper operation of the device, even during a prototyping phase, even if this value is different than the final design. 6.1.3 operation with an lcd MTCH6102 has integrated algorithms to detect and minimize the effects of noise, but proper care should always be taken in selecting an lcd and support components with a focus on reducing noise as much as possible. since the interaction between the touch sensor and display is highly dependent upon the physical arrangement of the components, proper testing should always be executed with a fully integrated device. please reference the appropriate projected capacitive touch screen manufacturer?s integration guide for additional design considerations. note: at no time should the device be expected to respond correctly to a user touching a bare pcb sensor. b a dim. typ. min. max. a 6 mm 4 mm 10 mm b 0.2 mm ? 0.5 mm free datasheet http://
? 2014 microchip technology inc. ds40001750a-page 11 MTCH6102 6.2 sensor layout configuration MTCH6102 is designed to work with sensors with a minimum of 3x3 sensor channels, and a total maximum of 15 channels. the number of channels on each axis is governed by the registers in tab l e 6 - 1 . for all sensor configurations, the following conditions must be met: 1. channel layout must start at rx0. 2. each axis must have the associated channels in either ascending or descending order. 3. no unconnected channel pins are allowed in the middle of a layout. table 6-2 shows an example of each rule being broken by a 6x5 sensor layout, followed by the correct layout in the last column. 6.3 sensor output resolution MTCH6102 interpolates 64 discrete points between each channel and 32 points past the centerline of each edge. as a result, the maximum value in the touchx and touchy registers will be (64xnumberofchannels) on each axis. for the default 9x6 sensor, this results in a maximum resolution of 576x384. table 6-1: registers associated with sensor layo ut configuration address name description 0x20 numberofxchannels number of channels used for x axis 0x21 numberofychannels number of channels used for y axis table 6-2: example of incorrect 6x5 sensor connections (1) (2) (3) correct rx0 x0 x0 x0 rx1 x1 x1 x1 rx2 x2 x2 x2 rx3 x4 x3 x3 rx4 x0 x3 x4 x4 rx5 x1 x5 x5 x5 rx6 x2 y0 y0 rx7 x3 y2 y1 rx8 x4 y1 y0 y2 rx9 x5 y3 y1 y3 rx10 y0 y4 y2 y4 rx11 y1 y3 rx12 y2 rx13 y3 y4 rx14 y4 free datasheet http://
MTCH6102 ds40001750a-page 12 ? 2014 microchip technology inc. 6.4 sensor orientation to aid in pcb layout, the sensor can be oriented in any direction, have either axis reversed, or even have the axes swapped. the host controller must take into account the x/y output and gesture orientation based on figure 6-2 . figure 6-2: sensor orientation examples rx0 rx8 rx9 rx14 (0,0) (0,384) (576,0) (576,384) rx0 rx8 rx14 rx9 (0,0) (0,384) (576,0) (576,384) rx8 rx0 rx9 rx14 (0,0) (0,384) (576,0) (576,384) rx8 rx0 rx14 rx9 (0,0) (0,384) (576,0) (576,384) free datasheet http://
? 2014 microchip technology inc. ds40001750a-page 13 MTCH6102 7.0 operating modes MTCH6102 operates in multiple modes (see table 7-1 ) governed by the mode register (see register 7-1 ). table 7-1: operating mode descriptions mode name description int behavior full full x/y and gesture decoding occurs (default mode) asserted if touch is present or if a change in touch status or a gesture have occurred touch full x/y decoding only asserted if touch is present or if a change in touch status occurs gesture full x/y and gesture decoding occurs, but int is no longer asserted for touch data asserted for gestures only (1) raw raw-capacitance signals are stored in rawadc registers, no decoding done. channel selection and type of measurement is governed by the modecon register none standby device is no longer sensing or performing baseline tasks none note 1: data in touch registers is still valid. register 7-1: mode: touch decode mode register u-x u-x u-x u-x r/w-0 r/w-0 r/w-1 r/w-1 ? ? ? ? mode<3:0> bit 7 bit 0 legend: r = readable bit ?1? = bit is set x = bit is unknown -n = value after initialization (default) w = writable bit ?0? = bit is cleared u = unimplemented bit q = conditional bit 7-4 unimplemented: read as ? 0 ? bit 3-0 mode<3:0>: touch decoding mode bits 0000 = standby 0001 = gesture 0010 = touch only 0011 = full (touch and gesture) 01xx =raw adc free datasheet http://
MTCH6102 ds40001750a-page 14 ? 2014 microchip technology inc. register 7-2: modecon: ra wadc mode control register r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 type<3:0> ch<3:0> bit 7 bit 0 legend: r = readable bit ?1? = bit is set x = bit is unknown -n = value after initialization (default) w = writable bit ?0? = bit is cleared u = unimplemented bit q = conditional bit 7-4 type<3:0>: cvd result arithmetic bits 0000 = (1023 ? result1) + result 2 0001 = result 1 only 0010 = result 2 only bit 3-0 ch<3:0>: rx sense channel bits 0000 =rx0 .. .. 1110 =rx14 1111 = reserved, do not use free datasheet http://
? 2014 microchip technology inc. ds40001750a-page 15 MTCH6102 8.0 controller commands various controller commands can be initiated by writing a ? 1 ? to the appropriate bit in the cmd register ( register 8-1 ). this bit will automatically be cleared after the command has been completed. register 8-1: cmd: command register r/w-0 r/w-0 r/w-0 u-x r/w-0 u-x u-x r/w-0 nv def cfg ?mfg ? ?bs bit 7 bit 0 legend: r = readable bit ?1? = bit is set x = bit is unknown -n = value after initialization (default) w = writable bit ?0? = bit is cleared u = unimplemented bit q = conditional bit 7 nv: nonvolatile storage write bit bit 6 def: restore controller to default configuration values bit bit 5 cfg: configure controller bit (after parameters have been changed) bit 4 unimplemented: read as ? 0 ? bit 3 mfg: execute manufacturing test bit bit 2-1 unimplemented: read as ? 0 ? bit 0 bs: force baseline bit (recalibration) to occur free datasheet http://
MTCH6102 ds40001750a-page 16 ? 2014 microchip technology inc. 9.0 touch frame control touch decoding is based around the concept of a touch frame that begins with acquisition, followed by decoding of the acquired values, and lastly a sleep phase for power savings. the duration of the touch frame is governed by the current touch state, as well as the timing registers outlined in this section (see table 9-1 ). figure 9-1 shows the interaction between these registers during a typical touch cycle. both active and idle period calculations are as shown in equation 9-1 . equation 9-1: typical frame rates have been computed for the user?s convenience and are shown in tab l e 9 - 2 . figure 9-1: touch frame timing table 9-1: registers associated with touch frame control address name description 0x25 activeperiodl active period 0x26 activeperiodh 0x27 idleperiodl idle period 0x28 idleperiodh 0x29 idletimeout idle timeout 0x2b debounceup liftoff debounce 0x2c debouncedown touch down debounce table 9-2: example frame rate period calculations desired rate (ms) period 10 0x0142 20 0x0284 50 0x064c 100 0x0c99 duration ms ?? 1000 ? 31 ------------------------------------------------------ - ?? ?? 1 period = + touch present sync up timer (4) down timer (2) idletimer (5) tch bit 0 5 0 101201 2 3 33 0123 3 010 0000 45 5 45 5555 45 555 454321 0 0 0 00000000000 5 5555 555 432 0 0 0 0 0 0 0 0 0 0 0 0 1 0 5555555 int idletimeout (5) debounceup (4) debouncedown (2) free datasheet http://
? 2014 microchip technology inc. ds40001750a-page 17 MTCH6102 10.0 touch data registers register 10-1: touchstate: current touch state register r/w-0 r/w-0 r/w-0 r/w-0 u-x r/w-0 r/w-0 r/w-0 frame<3:0> ? lrg ges tch bit 7 bit 0 legend: r = readable bit ?1? = bit is set x = bit is unknown -n = value after initialization (default) w = writable bit ?0? = bit is cleared u = unimplemented bit q = conditional bit 7-4 frame<3:0>: increments on every touch frame bit 3 unimplemented: read as ? 0 ? bit 2 lrg: large activation is present bit 1 ges: gesture is present bit 0 tch: touch is present register 10-2: touchlsb register r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 touchx<3:0> touchy<3:0> bit 7 bit 0 legend: r = readable bit ?1? = bit is set x = bit is unknown -n = value after initialization (default) w = writable bit ?0? = bit is cleared u = unimplemented bit q = conditional bit 7-4 touchx<3:0>: current x position (least significant bits) bit 3-0 touchy<3:0>: current y position (least significant bits) table 10-1: summary of registers associated with touch data address name bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 0x10 touchstate frame<3:0> ?lrg ges tch 0x11 touchx touchx<11:4> 0x12 touchy touchy<11:4> 0x13 touchlsb touchx<3:0> touchy<3:0> free datasheet http://
MTCH6102 ds40001750a-page 18 ? 2014 microchip technology inc. 11.0 acquisition and touch parameters 11.1 scancount every time a channel is scanned, it is scanned multiple times (scancount) and summed. increasing this number will give an inherent averaging effect, but at the cost of time and subsequently increased power consumption. 11.2 touchthreshx/ touchthreshy and hysteresis the presence of a touch is determined by the sensor channel?s current value compared to the touch thresholds set by touchthreshx (or touchthreshy if the channel is on the y axis). the hysteresis register contains a threshold modifier that acts as a dynamic threshold modifier depending on the state of the touch (higher without a touch). a single channel of touch is shown in figure 11-1 . figure 11-1: touch threshold and hysteresis functionality table 11-1: registers associated with acquisition and touch parameters address name default 0x22 scancount 6 0x23 touchthreshx 55 0x24 touchthreshy 40 0x2a hysteresis 4 0x31 filtertype 2 0x32 filterstrength 1 0x35 largeactivationthreshl 0 0x36 largeactivationthreshh 0 hysteresis touch threshold sensor amplitude touch detected free datasheet http://
? 2014 microchip technology inc. ds40001750a-page 19 MTCH6102 11.3 filtertype/filterstrength as new sensor values are acquired, they are filtered based on the settings of the filtertype/ filterstrength registers (see table 11-2 ). examples of the effects of each filter type are shown in figure 11-2 . figure 11-2: filter examples choosing the correct filtering option for the user?s application depends on the environment and sensor. note that while the median filter has good characteristics, it is not the most efficient and will consume more power than other filters. 11.4 large activation the largeactivationthresh registers provide a way to do simple rejection of signals that are too large to interpret. the amplitude of all sensor channels are added together and compared to this threshold. if greater, the lrg bit of the touchstate register ( register 10-1 ) will be set. note that this does not affect touch decoding. in other words, even if the large activation threshold is breached, the controller will still decode the touch position as normal. the lrg bit merely serves to inform the host that the large activation threshold has been reached. if this functionality is not intended to be used, this register should be set to zero, which will disable the large activation routines from running. table 11-2: filtertype and filterstrength definitions filtertype filterstrength valid values 0 ? no filter n/a ? 1 ? median size of median window 3, 5, 7, 9 2 ? i ir weighting of previous to current value 1, 2, 3 (1/2, 1/4 and 1/8 weighting accordingly) 3 ? average size of average window 1, 2, 3 (2, 4 and 8 accordingly) unfiltered (raw) data: median - strength 5 (window size 5) i ir - strength 1 (50/50) average C strength 2 (window size 4) free datasheet http://
MTCH6102 ds40001750a-page 20 ? 2014 microchip technology inc. 12.0 compensation ram it is very common for a typical touch sensor to have non-uniform capacitive properties. to equalize the sensor, a series of coefficients can be written to the compensation ram block. these coefficients represent a ratio that is applied to the individual channel in post-acquisition, before touch decoding occurs. equation 12-1: compensation ram calculation to obtain the correct compensation ram values, the following procedure should be used: 1. set all sensorvalues registers to zero (if necessary). 2. record the peak values that occur in the sensorvalues registers when using the sensor under normal conditions (column a of table 12-1 ). 3. pick a commonly occurring value to represent the median of the set (? 125 ?). 4. calculate the ratio of the peak value by dividing the median value by the peak (column b). 5. multiply this value by 64 and truncate (column c). these are the compensation values that should be written to the sensorcomp registers. please note that, if no compensation is required (value of ? 64 ?, ratio of ? 1 ?), the register should be set to ? 0 ?, to save time running compensation routines for that channel. 6. to see the expected output from the compensation values, follow equation 12-1 (result in column d). raw value ?? sensorcomp ? 64 --------------------------------------------------------------------------------------- - final value ?? = table 12-1: compensation ram example calculation ch a b c d 0 102 1.225 78 124 1 113 1.106 71 125 2 118 1.059 68 125 3 125 1 64 (0) 125 4 125 1 64 (0) 125 5 128 0.977 63 126 6 132 0.947 61 126 7 160 0.781 50 125 free datasheet http://
? 2014 microchip technology inc. ds40001750a-page 21 MTCH6102 13.0 baseline capacitive touch principles rely on analyzing a change in capacitance from a previously-stored baseline value (sometimes referred to as a calibration value). baseline routines and behavior can be tweaked using the registers listed in table 13-1 . 13.1 bs bit (cmd register) the bs bit forces the current sensor values to be stored as the baseline values, disregarding the constraints of baseposfilter and basenegfilter. 13.2 baseinterval it represents the number of touch frames between baseline sampling. data that is sampled will be applied at the next baseline interval, provided that a touch has not occurred between the two. if at any point, the touch threshold is breached, the baseline counter is reset, and a full interval without a touch must occur before baselining resumes. note that this value is specified in terms of the number of touch frames, so any changes in frame rate should take this into consideration by raising or lowering this interval accordingly. 13.3 baseposfilter/basenegfilter the positive and negative filters act as slew-rate limiters for a new baseline being applied. for example, if the new baseline value is larger than the previous by a value of 35, and the baseposfilter is set to 20 (default), the new baseline will only be increased by 20. use of these registers helps prevent unwanted spikes in the baseline value. 13.4 basefiltertype/ basefilterstrength baseline acquisition frames follow the same filter type and strength parameters as normal acquisition filters, defined in section 11.3 ?filtertype/filter- strength? . table 13-1: registers associated with baseline address bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 default 0x04 nv def cfg - mfg - -bs 0 0x2d baseintervall 10 0x2e baseintervalh 0 0x2f baseposfilter 20 0x30 basenegfilter 20 0x33 basefiltertype 2 0x34 basefilterstrength 1 free datasheet http://
MTCH6102 ds40001750a-page 22 ? 2014 microchip technology inc. 14.0 gesture features and parameters gesture detection and reporting is governed by the registers outlined in table 14-1 . when a gesture is performed, the gesture id will be placed in gesturestate, and the ges bit of the touchstate register will be set. both of these items are cleared after reading the gesturestate register. the gesturediag register contains a code explaining the logic behind the last operation of the gesture engine, primarily to help with debugging of the gesture parameters. these diagnostic codes are shown in register 14-2 . table 14-1: summary of registers associated with gestures address name bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 default 0x10 touchstate frame<3:0> - lrg ges tch n/a 0x14 gesturestate gesturestate 0 0x15 gesturediag gesturediag 0 0x37 horizontalswipedistance horizontalswipedistance 64 0x38 verticalswipedistance verticalswipedistance 64 0x39 swipeholdboundary swipeholdboundary 25 0x3a tapdistance tapdistance 25 0x3b distancebetweentaps distancebetweentaps 64 0x3c tapholdtime tapholdtimel 50 0x3d tapholdtimeh 0 0x3e gestureclicktime gestureclicktime 12 0x3f swipeholdthresh swipeholdthresh 32 0x40 minswipevelocity minswipevelocity 4 0x41 horizontalgestureangl e horizontalgestureangle 45 0x42 verticalgestureangle verticalgestureangle 45 free datasheet http://
? 2014 microchip technology inc. ds40001750a-page 23 MTCH6102 please note that the gesture orientations listed in register 14-1 are correct for a default layout, with right moving on increasing x-axis channels, and down moving on increasing y-axis channels. these default orientations are shown in figure 14-1 . depending on the application, the host may need to associate the gesture ids differently. figure 14-1: gesture orientation register 14-1: gesturestate: current gesture state register r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 gesturestate<7:0> bit 7 bit 0 legend: r = readable bit ?1? = bit is set x = bit is unknown -n = value after initialization (default) w = writable bit ?0? = bit is cleared u = unimplemented bit q = conditional bit 7-0 gesturestate<7:0>: 0x00 no gesture present 0x10 single click 0x11 click and hold 0x20 double click 0x31 down swipe 0x32 down swipe and hold 0x41 right swipe 0x42 right swipe and hold 0x51 up swipe 0x52 up swipe and hold 0x61 left swipe 0x62 left swipe and hold rx0 rx8 rx9 rx14 (0,384) (0,0) (576,384) (576,0) 0x41 right 0x61 left 0x51 up 0x31 down free datasheet http://
MTCH6102 ds40001750a-page 24 ? 2014 microchip technology inc. register 14-2: gesturediag: ge sture diagnostics register r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 gesturediag<7:0> bit 7 bit 0 legend: r = readable bit ?1? = bit is set x = bit is unknown -n = value after initialization (default) w = writable bit ?0? = bit is cleared u = unimplemented bit q = conditional bit 7-0 gesturediag<7:0>: 0x01 click timeout 0x02 swipe timeout 0x03 general timeout 0x04 click threshold exceeded 0x05 swipe threshold exceeded 0x06 swipe and hold threshold exceeded 0x07 swipe opposite direction threshold exceeded 0x08 reserved 0x09 swipe and hold value exceeded 0x0a outside swipe angle free datasheet http://
? 2014 microchip technology inc. ds40001750a-page 25 MTCH6102 14.1 gesture tuning figure 14-2: gesture p arameter visualization a f e b start end g d c h 1 2 i legend: 1. horizontalswipedistance/verticalswipedistance ( a/b ): distance that a touch must move from the initial touchdown to be considered a swipe. 2. swipeholdthresh ( c ): allowed movement in the opposite direction before a swipe is canceled. 3. minswipevelocity ( d ): once a movement is classified as a swipe , this distance must be kept frame to frame before the swipe is classified as a hold (direction of travel is not important). 4. horitzontalgestureangle/verticalgestureangle ( f/e ): angle in degrees allowed on horizontal (x-axis) and vertical (y-axis) swipe movements. swipes outside this parameter are detected, but not reported. 5. swipeholdboundary ( g ): once a swipe is classified as a hold , movement must not exceed this parameter in any direction. 6. distancebetweentaps ( h ): distance allowed between two taps to be considered a double click . 7. tapdistance ( i ): even when a sensor is pressed for a very short time (click), multiple frames of touch data occur. this parameter governs how close those individual touch points must be for a click . 8. tapholdtime (not shown): duration of time a click must be held for to be considered a click and hold. 9. gestureclicktime (not shown): maximum time between two clicks to be considered a double click. free datasheet http://
MTCH6102 ds40001750a-page 26 ? 2014 microchip technology inc. 15.0 configuring a non-default application when modifying sensor configuration parameters, the cfg bit of the cmd register must be set for the configuration to take effect. setting this bit analyzes the following registers for validity and coerces them if necessary: 1. idleperiod/activeperiod 2. filtertype/filterstrength 3. baselinefiltertype/filterstrength 4. numberofxchannels/numberofychan- nels afterwards, the values take effect, and the sensor is base-lined and ready for use. most applications will require custom parameters to be stored in the configuration ram. the following methods are recommended for achieving this: 1. for permanent configuration: either during manufacturing test or on first start-up, the host controller writes all configuration values to the controller, sets the cfg bit and stores them to nvram by using the nv bit. 2. for configuration on every power-up: the host writes all configuration data to the controller and sets the cfg bit on start-up. note: if the controller is not in standby mode when changing configuration parameters, unreliable touch data may be generated until the cfg is set. free datasheet http://
? 2014 microchip technology inc. ds40001750a-page 27 MTCH6102 16.0 manufacturing testing 16.1 automated manufacturing test to start the automated manufacturing test, set the mfg bit of the cmd register. this test re-purposes the same ram used for rawadc commands to store the results. when the test is complete, the mfg bit will be cleared. the results of the manufacturing test are stored in the registers shown in tab le 1 6- 1 . 16.2 sensor integrity testing to test the integrity of both the touch sensor and the overlay for defects, the following test outline is advised: 1. for this test, a way to retrieve data from the MTCH6102 will be required. this can be either through a host controller, or the host controller can conduct the test itself with pre-set test values. 2. collect the raw-capacitance values by reading the rawvalues registers under normal conditions on a set of at least 30 completely assembled sensors. 3. use the information collected in step 2 to determine the variance and average value for each sensor channel. these values will be used as the standard by which manufactured sensors will need to fall within. 4. for each new sensor produced, compare the rawvalues to the range described in step 3. if the sensor falls out of this range, inspect the sensor assembly for defects. 5. to test for touch acquisition ability, repeat steps 1-4 with a known touch stimulus applied (e.g., simulated metal finger). the above outline is intentionally generic, as manufacturing test setup will need to be modified for every application. table 16-1: mfg test rx look-up table (1,2) address bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 0xd0 ? ?rx13h ? rx12h rx11h rx10h rx9h 0xd1 ? ? rx13l ? rx12l rx11l rx10l rx9l 0xd2 ? ? rx8h rx7h rx6h rx5h rx4h rx3h 0xd3 ? ? rx8l rx7l rx6l rx5l rx4l rx3l 0xd4 rx2h rx1h rx0h ? ? rx14h ? ? 0xd5 rx2l rx1l rx0l ? ? rx14l ? ? note 1: rxnh: pin was unable to set high and is likely shorted to v dd . 2: rxnl: pin was unable to set low and is likely shorted to gnd. free datasheet http://
MTCH6102 ds40001750a-page 28 ? 2014 microchip technology inc. 17.0 memory map table 17-1: core ram memory map addr. name core ram bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 default 0x00 fwmajor fw major 0x02 0x01 fwminor fw minor 0x00 0x02 appid appidh <15:8> 0x00 0x03 appidl <7:0> 0x12 0x04 cmd nv def cfg ?mfg ? ?bs 0x00 0x05 mode ? ? ? ? mode<3:0> 0x03 0x06 modecon type<3:0> ch<3:0> 0x00 table 17-2: touch ram memory map addr. name touch ram bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 default 0x10 touchstate frame<3:0> ? lrg ges tch 0x00 0x11 touchx touchx<11:4> 0x00 0x12 touchy touchy<11:4> 0x00 0x13 touchlsb touchx<3:0> touchy<3:0> 0x00 0x14 gesturestate gesturestate 0x00 0x15 gesturediag gesturediagnostic 0x00 table 17-3: compensation ram memory map addr. compensation ram bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 0x50 sensorcomp ... ... 0x5f sensorcomp free datasheet http://
? 2014 microchip technology inc. ds40001750a-page 29 MTCH6102 table 17-4: acquisition ram memory map addr. acquisition ram bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 0x80 sensorvalues ... ... 0x8e sensorvalues ? 0x90 rawvalues ... ... 0xac rawvalues ? 0xb0 basevalues ... ... 0xcc basevalues ? 0xd0 rawadc<0> ... ... 0xef sensorvalues<31> free datasheet http://
MTCH6102 ds40001750a-page 30 ? 2014 microchip technology inc. table 17-5: configurat ion ram memory map addr. configuration ram bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 default 0x20 numberofxchannels 0x09 0x21 numberofychannels 0x06 0x22 scancount 0x06 0x23 touchthreshx 0x37 0x24 touchthreshy 0x28 0x25 activeperiodl 0x85 0x26 activeperiodh 0x02 0x27 idleperiodl 0x4c 0x28 idleperiodh 0x06 0x29 idletimeout 0x10 0x2a hysteresis 0x04 0x2b debounceup 0x01 0x2c debouncedown 0x01 0x2d baseintervall 0x0a 0x2e baseintervalh 0x00 0x2f baseposfilter 0x14 0x30 basenegfilter 0x14 0x31 filtertype 0x02 0x32 filterstrength 0x01 0x33 basefiltertype 0x01 0x34 basefilterstrength 0x05 0x35 largeactivationthreshl 0x00 0x36 largeactivationthreshh 0x00 0x37 horizontalswipedistance 0x40 0x38 verticalswipedistance 0x40 0x39 swipeholdboundary 0x19 0x3a tapdistance 0x19 0x3b distancebetweentaps 0x40 0x3c tapholdtimel 0x32 0x3d tapholdtimeh 0x00 0x3e gestureclicktime 0x0c 0x3f swipeholdthresh 0x20 0x40 minswipevelocity 0x04 0x41 horizontalgestureangle 0x2d 0x42 verticalgestureangle 0x2d 0x43 i 2 caddr 0x25 free datasheet http://
? 2014 microchip technology inc. ds40001750a-page 31 MTCH6102 18.0 electrical characteristics 18.1 absolute maximum ratings (?) ambient temperature under bias................................................................................................. ....... -40c to +85c storage temperature ............................................................................................................ ............ -65c to +150c voltage on pins with respect to v ss on v dd pin........................................................................................................................... ...... -0.3v to +4.0v on all other pins.............................................................................................................. ..0.3v to (v dd + 0.3v) maximum current out of v ss pin ........................................................................................................................... ............ 340 ma into v dd pin .......................................................................................................................... ............... 255 ma maximum output current sunk by any i/o pin ........................................................................................................... .................... 25 ma sourced by any i/o pin ........................................................................................................ .................. 25 ma 18.2 standard operating conditions the standard operating conditions for any device are defined as: operating voltage: v ddmin ?? v dd ?? v ddmax operating temperature: t a _ min ?? t a ?? t a _ max v dd ? operating supply voltage MTCH6102 v ddmin .............................................................................................................................. ......... 1.8v v ddmax ............................................................................................................................... ....... 3.6v t a ? operating ambient temperature range industrial temperature t a _ min ............................................................................................................................... ....... ?40c t a _ max ............................................................................................................................... ..... +85c note: this device is sensitive to esd damage and must be handled appropriately. failure to properly handle and protect the device in an application may cause partial to complete failure of the device. ? notice: stresses above those listed under ?absolute maximum ratings? may cause permanent damage to the device. this is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. exposure above maximum rating conditions for extended periods may affect device reliability. free datasheet http://
MTCH6102 ds40001750a-page 32 ? 2014 microchip technology inc. 18.3 dc characteristics table 18-1: operating conditions rating min. typ. max. units supply voltage 1.8 ? 3.6 v supply current (full active, no frame rate) 0.7 ? 1.17 ma supply current (sleep) <1 ua table 18-2: i/o ports dc characteristics standard operating conditions (unless otherwise stated) param. no. sym. characteristic min. typ.? max. units conditions v il input low voltage i/o port: d030 with ttl buffer ? ? 0.15 v dd v1.8v ? v dd ? 4.5v d031 with schmitt trigger buffer ? ? 0.2 v dd v2.0v ? v dd ? 5.5v with i 2 c? levels ? ? 0.3 v dd v with smbus levels ? ? 0.8 v 2.7v ? v dd ? 5.5v d032 reset , osc1 (rc mode) ? ? 0.2 v dd v d033 osc1 (hs mode) ? ? 0.3 v dd v v ih input high voltage i/o ports: d040 with ttl buffer 0.25 v dd + 0.8 ? ? v 1.8v ? v dd ? 4.5v d041 with schmitt trigger buffer 0.8 v dd ??v2.0v ? v dd ? 5.5v with i 2 c levels 0.7 v dd ??v with smbus levels 2.1 ? ? v 2.7v ? v dd ? 5.5v d042 reset 0.8 v dd ??v d043a osc1 (hs mode) 0.7 v dd ??v d043b osc1 (rc mode) 0.9 v dd ??v note 1 i il input leakage current (2) d060 i/o ports ? 5 125 na v ss ? v pin ? v dd , pin at high-impedance at 85c d061 reset (2) ? 50 200nav ss ? v pin ? v dd at 85c * these parameters are characterized but not tested. ? data in ?typ.? column is at 3.0v, 25c unless otherwise stated. these parameters are for design guidance only and are not tested. note 1: negative current is defined as current sourced by the pin. 2: the leakage current on the reset pin is strongly dependent on the applied voltage level. the specified levels represent normal operating conditions. higher leakage current may be measured at different input voltages. free datasheet http://
? 2014 microchip technology inc. ds40001750a-page 33 MTCH6102 i pur weak pull-up current d070* 25 100 200 ? av dd = 3.3v, v pin = v ss v ol output low voltage d080 i/o ports ? ? 0.6 v i ol = 6 ma, v dd = 3.3v i ol = 1.8 ma, v dd = 1.8v v oh output high voltage d090 i/o ports v dd - 0.7 ? ? v i oh = 3 ma, v dd = 3.3v i oh = 1 ma, v dd = 1.8v c io capacitive loading specs on output pins d101* all i/o pins ? ? 50 pf table 18-2: i/o ports (continued) dc characteristics standard operating conditions (unless otherwise stated) param. no. sym. characteristic min. typ.? max. units conditions * these parameters are characterized but not tested. ? data in ?typ.? column is at 3.0v, 25c unless otherwise stated. these parameters are for design guidance only and are not tested. note 1: negative current is defined as current sourced by the pin. 2: the leakage current on the reset pin is strongly dependent on the applied voltage level. the specified levels represent normal operating conditions. higher leakage current may be measured at different input voltages. free datasheet http://
MTCH6102 ds40001750a-page 34 ? 2014 microchip technology inc. 18.4 ac characteristics and timing parameters figure 18-1: i 2 c? bus data timing table 18-3: i 2 c? bus data requirements param. no. symbol characteristic min. max. units conditions sp100* t high clock high time 400 khz mode 0.6 ? ? s ssp module 1.5t cy ?? sp101* t low clock low time 400 khz mode 1.3 ? ? s ssp module 1.5t cy ?? sp102* t r sdax and sclx rise time 400 khz mode 20 + 0.1c b 300 ns sp103* t f sdax and sclx fall time 400 khz mode 20 + 0.1c b 250 ns sp106* t hd : dat data input hold time 400 khz mode 0 0.9 ? s sp107* t su : dat data input setup time 400 khz mode 100 ? ns sp109* t aa output valid from clock 400 khz mode ? ? ns sp110* t buf bus free time 400 khz mode 1.3 ? ? s sp111 c b bus capacitive loading ? 400 pf * these parameters are characterized but not tested. sp90 sp91 sp92 sp100 sp101 sp103 sp106 sp107 sp109 sp109 sp110 sp102 sclx sdax in sdax out free datasheet http://
? 2014 microchip technology inc. ds40001750a-page 35 MTCH6102 19.0 ordering information table 19-1: ordering information part number pin package packing MTCH6102-i/ss 28-lead ssop (5.30 mm) tube MTCH6102-i/mv 28-lead uqfn (4x4x0.5 mm) tube MTCH6102t-i/ss 28-lead ssop (5.30 mm) t/r MTCH6102t-i/mv 28-lead uqfn (4x4x0.5 mm) t/r free datasheet http://
MTCH6102 ds40001750a-page 36 ? 2014 microchip technology inc. 20.0 packaging information 20.1 package marking information legend: xx...x customer-specific information y year code (last digit of calendar year) yy year code (last 2 digits of calendar year) ww week code (week of january 1 is week ?01?) nnn alphanumeric traceability code pb-free jedec ? designator for matte tin (sn) * this package is pb-free. the pb-free jedec designator ( ) can be found on the outer packaging for this package. note : in the event the full microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e 28-lead ssop (5.30 mm) example 28-lead uqfn (4x4x0.5 mm) example pin 1 pin 1 1 111 i 1i 11 28-lead plastic shrink small outline ? 5.30 mm body [ssop] 28-lead plastic ultra thin quad flat, no lead package ? 4x4x0.5 mm body [uqfn] free datasheet http://
? 2014 microchip technology inc. ds40001750a-page 37 MTCH6102 20.2 package details the following sections give the technical details of the packages.
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MTCH6102 ds40001750a-page 38 ? 2014 microchip technology inc. note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging free datasheet http://
? 2014 microchip technology inc. ds40001750a-page 39 MTCH6102 note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging free datasheet http://
MTCH6102 ds40001750a-page 40 ? 2014 microchip technology inc. note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging free datasheet http://
? 2014 microchip technology inc. ds40001750a-page 41 MTCH6102 free datasheet http://
MTCH6102 ds40001750a-page 42 ? 2014 microchip technology inc. appendix a: data sheet revision history revision a (03/2014) initial release of the document. free datasheet http://
? 2014 microchip technology inc. ds40001750a-page 43 MTCH6102 the microchip web site microchip provides online support via our www site at www.microchip.com . this web site is used as a means to make files and information easily available to customers. accessible by using your favorite internet browser, the web site contains the following information: ? product support ? data sheets and errata, application notes and sample programs, design resources, user?s guides and hardware support documents, latest software releases and archived software ? general technical support ? frequently asked questions (faq), technical support requests, online discussion groups, microchip consultant program member listing ? business of microchip ? product selector and ordering guides, latest microchip press releases, listing of seminars and events, listings of microchip sales offices, distributors and factory representatives customer change notification service microchip?s customer notification service helps keep customers current on microchip products. subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. to register, access the microchip web site at www.microchip.com . under ?support?, click on ?customer change notification? and follow the registration instructions. customer support users of microchip products can receive assistance through several channels: ? distributor or representative ? local sales office ? field application engineer (fae) ? technical support customers should contact their distributor, representative or field application engineer (fae) for support. local sales offices are also available to help customers. a listing of sales offices and locations is included in the back of this document. technical support is available through the web site at: http://microchip.com/support free datasheet http://
ds40001750a-page 44 ? 2014 microchip technology inc. information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. it is your responsibility to ensure that your application meets with your specifications. microchip makes no representations or warranties of any kind whether express or implied, written or oral, statutory or otherwise, related to the information, including but not limited to its condition, quality, performance, merchantability or fitness for purpose . microchip disclaims all liability arising from this information and its use. use of microchip devices in life support and/or safety applications is entirely at the buyer?s risk, and the buyer agrees to defend, indemnify and hold harmless microchip from any and all damages, claims, suits, or expenses resulting from such use. no licenses are conveyed, implicitly or otherwise, under any microchip intellectual property rights. trademarks the microchip name and logo, the microchip logo, dspic, flashflex, k ee l oq , k ee l oq logo, mplab, pic, picmicro, picstart, pic 32 logo, rfpic, sst, sst logo, superflash and uni/o are registered trademarks of microchip technology incorporated in the u.s.a. and other countries. filterlab, hampshire, hi-tech c, linear active thermistor, mtp, seeval and the embedded control solutions company are registered trademarks of microchip technology incorporated in the u.s.a. silicon storage technology is a registered trademark of microchip technology inc. in other countries. analog-for-the-digital age, application maestro, bodycom, chipkit, chipkit logo, codeguard, dspicdem, dspicdem.net, dspicworks, dsspeak, ecan, economonitor, fansense, hi-tide, in-circuit serial programming, icsp, mindi, miwi, mpasm, mpf, mplab certified logo, mplib, mplink, mtouch, omniscient code generation, picc, picc-18, picdem, picdem.net, pickit, pictail, real ice, rflab, select mode, sqi, serial quad i/o, total endurance, tsharc, uniwindriver, wiperlock, zena and z-scale are trademarks of microchip technology incorporated in the u.s.a. and other countries. sqtp is a service mark of microchip technology incorporated in the u.s.a. gestic and ulpp are registered trademarks of microchip technology germany ii gmbh & co. kg, a subsidiary of microchip technology inc., in other countries. all other trademarks mentioned herein are property of their respective companies. ? 2014, microchip technology incorporated, printed in the u.s.a., all rights reserved. printed on recycled paper. isbn: 978-1-63276-043-2 note the following details of the code protection feature on microchip devices: ? microchip products meet the specification cont ained in their particular microchip data sheet. ? microchip believes that its family of products is one of the mo st secure families of its kind on the market today, when used i n the intended manner and under normal conditions. ? there are dishonest and possibly illegal me thods used to breach the code protection f eature. all of these methods, to our knowledge, require using the microchip products in a manner outside the operating specifications c ontained in microchip?s data sheets. most likely, the person doing so is engaged in theft of intellectual property. ? microchip is willing to work with the customer w ho is concerned about the integrity of their code. ? neither microchip nor any other semiconductor manufacturer c an guarantee the security of their code. code protection does not mean that we are guaranteeing the product as ?unbreakable.? code protection is constantly evolving. we at microchip are committed to continuously improving the code protection features of our products. attempts to break microchip?s code protection feature ma y be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that act. microchip received iso/ts-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona; gresham, oregon and design centers in california and india. the company?s quality system processes and procedures are for its pic ? mcus and dspic ? dscs, k ee l oq ? code hopping devices, serial eeproms, microperipherals, nonvolatile memory and analog products. in addition, microchip?s quality system for the design and manufacture of development systems is iso 9001:2000 certified. quality management s ystem certified by dnv == iso/ts 16949 == free datasheet http://
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